Jacopo Iannacci, Senior Member of the IEEE. Researcher in Microsystem technologies at Fondazione Bruno Kessler (FBK), Trento, Italy
Short Bio: Jacopo Iannacci (M’20, SM’21) received the MSc (Laurea) degree in electronics engineering from the University of Bologna, Italy, in 2003, and the PhD in information and telecommunications technology from the Advanced Research Center on Electronic Systems “Ercole De Castro” (ARCES) at the University of Bologna, Italy, in 2007. He received the Habilitation as Associate Professor in Electronics from the Italian Ministry of Education, University and Research (MIUR), in 2017, and the Habilitation as Full Professor in Electronics from the Italian Ministry of University and Research (MUR), in 2021. He worked in 2005 and 2006 as visiting researcher at the DIMES Technology Center (currently Else Kooi Lab) of the Technical University of Delft, the Netherlands, focusing on the development of innovative packaging and integration technology solutions for RF-MEMS devices. In 2016, he visited as seconded researcher the Fraunhofer Institute for Reliability and Microintegration IZM in Berlin, Germany, to conduct high-frequency characterization of RF-MEMS components jointly with the RF & Smart Sensor Systems Department at IZM. Since 2007, he is researcher (permanent staff) at the Center for Sensors & Devices of Fondazione Bruno Kessler, in Trento, Italy. His research interests and experience fall in the areas of Finite Element Method (FEM) multi-physics modelling, compact (analytical) modeling, design, optimization, integration, packaging, experimental characterization and testing for reliability of MEMS and RF-MEMS devices and networks for sensors and actuators, Energy Harvesting (EH-MEMS) and telecommunication systems, with applications in the fields of 5G, Internet of Things (IoT), as well as future 6G, Tactile Internet (TI) and Super-IoT.